Thermal Paste 8.0 W/mK 30ml, TG-N8000 Non-Silicone Putty, Thermal Gel Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

Price: ₹36,526.51 - ₹22,829.07
(as of May 15, 2025 13:01:05 UTC – Details)


Specification:
Thermal Conductivity:8.0±10%W/mK
Viscosity: 430±100Pa·s
Density: 3±5%g/cm³
Operating Temperature: -40~125°C
Volume Resistivity: 1×10^13 Ohm-m
*Syringe should be used with glue gun
Application:
Electronic components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle,Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.
Features:
Silicone-type spacer with great long term reliability
Lower thermal resistance than thermal pads
Physical property between liquid and solid state
Elimination of different gap between heat source and the heatsink
Can applied with dispenser
Operating Manual:

1.Push the latch and insert the stick.
2.Put the tube in and twist.
3.Close the cover.
4.Take off the plug.
Storage:
Store in a cool, dry place away from direct sunlight.
Silicone-type spacer with great long term reliability
Lower thermal resistance than thermal pads
Physical property between liquid and solid state
Elimination of different gap between heat source and the heatsink
Can applied? with dispenser?