Price: ₹699 - ₹329.00
(as of Apr 19, 2025 15:59:02 UTC – Details)
Product Description
Specially designed for overclocking
Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.
WETEK Silicone Compounds Thermal Grease Paste Heat Sink Compound for CPU and Chipsets Graphics Card LED IC (Grey, 30 g)
This Thermal Compound Paste for All Coolers Easy to Apply with an ideal consistency, very easy to use, even for beginners. The possibilities for its application and the most effective way to avoid voids between CPU and cooler. Safe Application: It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compound, it ensures that get with any electrical pins would not result in damage of any sort. High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C. A high-performance thermal compound perfect for system builders.
Exclusive Design
Thermal Paste was made with high-quality materials to get better thermal conductivity, and there is an exclusive design that is a little thicker while using, to avoid it flowing to the hardware around the CPU.
Excellent Performance
This compound thermal paste is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently
Safe Application
It does not contain any metallic particles so electrical conductivity would not be an issue. Unlike silver and copper compounds, it ensures that contact with any electrical pins would not result in damage of any sort.
How to Use
Clean the object and heat sink surfaces
Wipe the surface lightly with a cotton ball or cotton swab dampened with isopropyl alcohol. The higher the percentage of alcohol the better. 70 percent is good but 90 percent is better (if you can find it).
Sand the heat sink and object surfaces if necessary
Thermal paste is designed to fill in the gaps and imperfections on the surfaces that you are joining. Since modern production techniques cannot make surfaces without imperfections, thermal paste will always be necessary.
How to Apply Thermal Paste
The lines method – Place two thin lines of thermal compound on the base of the cooler. The lines should be parallel and spaced so that they are each placed a third of the width of the processor. The lines themselves should also be about a third of the processor’s width in length.The cross method – This is very similar to the previous method, but the lines are crossed in an “X” pattern instead of parallel. The length and thickness of the lines should be the same as the previous method.The spread method – This is one of the most popular and effective methods, but takes a little more effort. Place a small amount of thermal paste onto the base of the cooler. Using a plastic finger protector or a plastic bag, use your finger to spread the paste evenly across the surface. Make sure to cover the entire surface that will be in contact with the processor, and ensure that you do not apply the paste too thick. In most cases, the paste should barely hide the metal underneath.
✔️Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
✔️It Is Used For Maintaining A Positive Heat-Sink Seal That Improves Heat Transfer From The Electrical / Electronic Component / Device To The Heat Sink Or Chassis Thereby Increasing The Overall Efficiency Of The Component / Device
✔Notice: The Net Weight Of This Silicon Grease Is As Written In Title, Thermal Conductivity : >0.965 W/M-K Thermal Resistance : <0.225°C-In²/W Working Temperature Range: - 30 ℃~ 180 ℃
✔The Heat Sink Paste Is Metal-Free And Non-Electrical Conductive Which Eliminates Any Risks Of Causing Short Circuit, Adding More Protection To The CPU And VGA Cards.
✔With an ideal consistency, is very easy to use, even for beginners. Once applied, you do not need to apply it again as it will last at least for years.
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